Providing a reference voltage to a cross point memory array

ABSTRACT

Providing a reference voltage to a cross point memory array. The invention is a cross point memory array and some peripheral circuitry that, when activated, provides a reference voltage to a cross point array in order to prevent unselected conductive array lines from floating to an undesired voltage. The peripheral circuitry can be activated before, after or during selection of a specific memory plug. If the peripheral circuitry is activated during selection, only the unselected conductive array lines should be brought to the reference voltage. Otherwise, all the conductive array lines can be brought to the reference voltage.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. ProvisionalApplication No. 60/400,849, filed Aug. 02, 2002, the U.S. ProvisionalApplication No. 60/422,922, filed Oct. 31, 2002, and the U.S.Provisional Application 60/424,083, filed Nov. 5, 2002, all of which areincorporated herein by reference in their entireties and for allpurposes. This application is related to sister applications entitled“Cross Point Memory Array Using Multiple Thin Films,” “Cross PointMemory Array Using Multiple Modes of Operation,” “Cross Point MemoryArray Using Distinct Voltages,” “Cross Point Memory Array With MemoryPlugs Exhibiting A Characteristic Hysteresis,” “Multi-OutputMultiplexor,” and “Multiplexor Outputting A Reference Voltage OnUnselected Lines,” all of which were filed on date even herewith and arehereby incorporated herein by reference in their entireties and for allpurposes.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates generally to memory, and morespecifically to memory employing a cross point array.

[0004] 2. Description of the Related Art

[0005] Conventional nonvolatile memory requires three terminalMOSFET-based devices. The layout of such devices are not ideal, usuallyrequiring feature sizes of 8f² for each memory cell, where f is theminimum feature size.

[0006] However, not all memory elements require three terminals. Certaincomplex metal oxides (CMOs), for example, can retain a resistive stateafter being exposed to an electronic pulse, which can be generated fromtwo terminals. U.S. Pat. No. 6,204,139, issued Mar. 20, 2001 to Liu etal., incorporated herein by reference for all purposes, describes someperovskite materials that exhibit such characteristics. The perovskitematerials are also described by the same researchers in“Electric-pulse-induced reversible resistance change effect inmagnetoresistive films,” Applied Physics Letters, Vol. 76, No. 19, 8 May2000, and “A New Concept for Non-Volatile Memory: The Electric-PulseInduced Resistive Change Effect in Colossal Magnetoresistive ThinFilms,” in materials for the 2001 Non-Volatile Memory TechnologySymposium, all of which are hereby incorporated by reference for allpurposes.

[0007] Similarly, the IBM Zurich Research Center has also publishedthree technical papers that also discuss the use of metal oxide materialfor memory applications: “Reproducible switching effect in thin oxidefilms for memory applications,” Applied Physics Letters, Vol. 77, No. 1,3 Jul. 2000, “Current-driven insulator-conductor transition andnonvolatile memory in chromium-doped SrTiO₃ single crystals,” AppliedPhysics Letters, Vol. 78, No. 23, 4 Jun. 2001, and “Electric currentdistribution across a metal-insulator-metal structure during bistableswitching,” Journal of Applied Physics, Vol. 90, No. 6, 15 Sep. 2001,all of which are hereby incorporated by reference for all purposes.

[0008] Similarly, magnetic RAM (MRAM) requires only two terminals todeliver a magnetic field to the memory element. Other two terminaldevices include Ovonic Unified Memory (OUM), which uses chalcogeniclayers of material, and various types of ferroelectric memory. With onlytwo terminals, it has been theorized that memory can be arranged in across point architecture.

[0009] However, mere recognition that a two terminal memory element istheoretically capable of being placed in a cross point array does notsolve many of the non-trivial problems associated with actually creatingsuch a device.

SUMMARY OF THE INVENTION

[0010] The present invention provides a cross point memory array. In oneembodiment, the memory array includes a first layer of conductive arraylines, a second layer of conductive array lines, reference voltageproviding circuitry and a plurality of memory plugs.

[0011] The first layer of conductive array lines is arranged so thatthey do not come into direct contact with each other. Similarly, thesecond layer of conductive array lines is arranged so that they do notcome into direct contact with either each other or any of the conductivearray lines of the first layer.

[0012] The plurality of memory plugs are located at the intersections ofthe first layer of conductive array lines and the second layer ofconductive array lines. Each memory plug is in electrical contact withone of the conductive array lines from the first layer and one of theconductive array lines from the second layer such that each memory plugis associated with a unique pair of conductive array lines.

[0013] A single memory plug can be selected by selecting a unique pairof conductive array lines that is associated with the single memoryplug, the unique pair consisting of a first layer conductive array lineand a second layer conductive array line. A first select voltage is thenapplied to the first layer conductive array line and a second selectvoltage is applied to the second layer conductive array line.

[0014] The conductive array lines are in electrical contact with thereference voltage providing circuitry, which operates to provide areference voltage to the conductive array lines when activated. Thereference voltage providing circuitry can be activated before, after orduring selection of a specific memory plug. If the peripheral circuitryis activated during selection, only the unselected conductive arraylines should be brought to the reference voltage. Otherwise, all theconductive array lines can be brought to the reference voltage.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The invention may best be understood by reference to thefollowing description taken in conjunction with the accompanyingdrawings, in which:

[0016]FIG. 1 depicts an exemplary cross point memory array in aperspective view;

[0017]FIG. 2 depicts an exemplary memory plug in contact with twoconductive array lines in a side view;

[0018]FIG. 3 depicts the exemplary cross point memory array in a planview;

[0019]FIG. 4 is a graph illustrating exemplary IV characteristics of amemory plug;

[0020]FIG. 5A is a block diagram depicting the logical connections ofvarious systems that contribute to selecting a memory plug;

[0021]FIG. 5B is a block diagram depicting the physical connections ofthe various systems that contribute to selecting a memory plug;

[0022]FIG. 6A is a block diagram depicting one mechanism for preventingthe unselected conductive array lines from floating to an undesiredvoltage;

[0023]FIG. 6B is a block diagram depicting another mechanism forpreventing the unselected conductive array lines from floating to anundesired voltage;

[0024]FIG. 6C is a block diagram depicting an improvement on themechanism for preventing the unselected conductive array lines fromfloating to an undesired voltage depicted in FIG. 6B;

[0025]FIG. 6D is a block diagram depicting an improvement on themechanism for preventing the unselected conductive array lines fromfloating to an undesired voltage depicted in FIG. 6C;

[0026]FIG. 6E is a block diagram depicting yet another mechanism forpreventing the unselected conductive array lines from floating to anundesired voltage by using a 3-output driver;

[0027]FIG. 7 is a block diagram depicting one possible configuration ofa 3-output driver;

[0028]FIG. 8A is a graph illustrating exemplary RV characteristics of amemory element initially biased in one direction

[0029]FIG. 8B is a graph illustrating exemplary RV characteristics of amemory element initially biased in the other direction;

[0030]FIG. 9 is an exemplary flow chart of various processing steps thatcould be involved in a cross point array; and

[0031]FIG. 10 is an exemplary memory cell that is formed using theprocessing steps in a side view.

[0032] It is to be understood that, in the drawings, like referencenumerals designate like structural elements. Also, it is understood thatthe depictions in the figures are not necessarily to scale.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033]FIG. 1 depicts an exemplary cross point array 100. A bottom layerof x-direction conductive array lines 105 and a top layer of y-directionconductive array lines 110 sandwiches a plurality of memory plugs 115.The conductive array lines 105 and 110 are arranged in the cross pointarray 100 so that each individual memory plug is capable of beinguniquely identified and, therefore, uniquely selected by a singlex-direction conductive array line and a single y-direction conductivearray line.

[0034] Conductive array lines 105 and 110 can be constructed of anyconductive material, such as aluminum, copper, tungsten or certainceramics. Ideally, the material will withstand a high-temperaturefabrication process, have a low inherent resistance, and have a lowcost. Often, however, compromises will have to be made.

[0035] For example, if the memory element is a CMO, very hightemperatures might be required to form a polycrystalline or a singlecrystalline structure. Depending upon the fabrication process (e.g.,solution based spin on followed by high temperature anneal, pulsed laserdeposition, sputtering, and metalorganic chemical vapor deposition) thefabrication temperature might require that refractory metals be used forconductive array lines. However, refractive array lines have higherresistances, which means that a given x-direction conductive array linewould not be able to timely access as many y-direction conductive arraylines as a lower resistance conductive array line, reducing the numberof memory cells on the cross-point array 100. Therefore, compromisesmust be made in order to balance cost, size, resistivity and preferredfabrication techniques. Typically, a conductive array line would crossbetween 64 and 8192 perpendicular conductive array lines. Although thex-direction and y-direction conductive array lines can be of equallengths (forming a square cross point array) they can also be of unequallengths (forming a rectangular cross point array).

[0036] Each memory plug in the plurality of memory plugs 115 contains amemory element along with any other materials that may be necessary,such as an insulating layer in an MRAM or a seed layer in a CMO.Additionally, a CMO memory plug would preferably include a non-ohmicdevice, as is described in co-pending application “High Density NVRAM,”U.S. application Ser. No. 10/160,321, filed May 31, 2002. The non-ohmicdevice exhibits a very high resistance regime for a certain range ofvoltages (V_(NO−) to V_(NO+)) and a very low resistance regime forvoltage above and below that range.

[0037]FIG. 2 depicts a side view of an exemplary memory plug 205 withseven separate thin-film layers and sandwiched between two conductivearray lines 210 and 215. The seven layers are: an electrode layer 220, alayer of CMO material 225 providing the memory element), anotheroptional electrode layer 230, three layers that make up ametal-insulator-metal (MIM) structure 235, 240 and 245 (providing thenon-ohmic device), and an optional final electrode 250.

[0038] The electrode layers 220, 230 and 250 are only necessary to theextent fabrication methods require them. Therefore, electrode layers220, 230 and 250 would ideally be as thin as possible while stillpreventing metal inter-diffusion and, if necessary, being useful as aseed layer. Typical electrode layers 220, 230 and 250 commonly used infabrication include Pt, Au, Ag and Al. If the electrode layers 220, 230and 250 are used only as a barrier to prevent metal inter-diffusion,then a thin layer metal, e.g. TiN, could be used. Any number ofelectrically conductive materials can be used for CMO material's 225seed layer 220. For example, the seed layer 220 could be a conductiveperovskite, such as LaNiO₃ or SrRuO₃ on Pt, a conductive metal oxide,such as IrO₂ on Ir or RuO₂ on Ru, a noble metal such as Pt on TiN. Tomake fabrication more efficient, the other electrode layers 230 and 250could use the same conductive layer that was used on the seed layer 220.

[0039] The CMO material 225 thickness is dictated by the desiredresistive states of the CMO material 225 and the write threshold voltage(V_(wth)). Although very dramatic differences (e.g., 1000 timesdifference) between a low resistance state (R₁) and a high resistivestate (R₀) could be sensed very easily, the voltage that drives suchresistances would be less than ideal. Since large currents can bedestructive to semiconductors fabricated to small dimensions, no morethan 10 μA would be desired for a memory circuit in most cases.Therefore, a modest difference between R₀ and R₁ would typically be abetter choice. For example, if 1 volt were used as a read voltage(V_(R)), R₁ might be about 100 kΩ and R₀ might be about 1 MΩ, making thecurrent either 10 μA or 1 μA, depending on the resistive state. Once aV_(R) is identified, a desired write voltage (V_(w)) can be determined.Not only should V_(w) be greater than V_(R), but it should also be farenough away from V_(R) to allow minor voltage fluctuations (e.g., due tofabrication imperfections) to have a negligible effect on the CMOmaterial 225. Similarly, V_(W) should be greater than V_(Wth) for thesame reason. A typical V_(W) might be about 2 volts, and V_(Wth) mightbe about 1.5 volts. A CMO material 225 with a V_(Wth) of 1.5 volts mightbe between 1000 Å and 3000 Å thick.

[0040] The CMO material 225 will generally be a crystalline orpolycrystalline perovskite structure. Generally, the CMO material 225includes two or more metals, the metals being selected from the groupconsisting of transition metals, alkaline earth metals and rare earthmetals. The CMO material 225 can be any number of compositions,including manganites (e.g., Pr_(0.7)Ca_(0.3)MnO₃, Pr_(0.5)Ca_(0.5)MnO₃and other PCMOs, LCMOs, etc.), titanites (e.g., STO:Cr), zirconates(e.g., SZO:Cr, Ca₂Nb₂O₇:Cr, and Ta₂O₅:Cr), and high Tc superconductors(e.g., YBCO). Specifically, MnO₃, when combined with the rare earthmetals La, Pr or some combination thereof and the alkaline earth metalsCa, Sr or some combination thereof have been found to produce aparticularly effective CMO material 225 for use in a memory plug 205.

[0041] The properties of the MIM structure 235, 240 and 245 (an exampleof a non-ohmic device) would then be dependant on ½ V_(R). FIG. 3illustrates selection of a cell in the cross point array 100. The pointof intersection between a single x-direction conductive array line 305and a single y-direction conductive array line 310 uniquely identifies asingle memory plug 315. However, the selected conductive array lines 305and 310 deliver a voltage to every memory plug associated with thoseconductive array lines. Therefore, the non-ohmic device must be able toblock current of the maximum voltage that will be seen on a singleconductive array line but pass current from the minimum voltage seen ona selected memory plug. If each conductive array line 305 and 310supplies half the required voltage of each operation, then ½ V_(W)′would be the maximum voltage on a single conductive array line andV_(R)′ would be the minimum voltage seen on a selected memory plug.V_(W)′ is V_(W) plus all other voltage drops in the memory plug 315(e.g., V_(NO+)) and V_(R)′ is V_(R) plus all other voltage drops in thememory plug 315.

[0042] If the non-ohmic device is the only other element that causes avoltage drop, the minimum V_(NO+) can be calculated from V_(NO+)=½V_(W)′=½ (V_(NO+)+V_(W))=V_(W)). A V_(NO+) of 2V would cause V_(W)′ tobe 4V and V_(R)′ to be 3V. However, a higher V_(NO+) might beappropriate to allow for some fabrication inconsistencies and otheradditional elements in the memory plug that provides a voltage drop. Forexample, with a V_(W)=2V, a V_(NO+) of 4V would cause V_(W)′ to be atleast 6V and V_(R)′ to be at least 4V. Once a V_(NO+) is selected, thenthe thickness of the non-ohmic device (e.g., MIM 235, 240 and 245) canbe calculated. FIG. 4 illustrates exemplary IV characteristics of amemory plug.

[0043] The metal portion 235 and 245 of the MIM can be made of anyconductive material. However, to make fabrication more efficient, themetal portion 235 and 245 of the MIM could use the same conductive layerthat was used with the seed layer 220. Therefore, metal layers 235 and245 of the MIM could also also serve as the electrode layers 230 and250, removing the need to have a separate electrode layers 230 and 250.The insulator layer 240 of the MIM can be realized with Ta₂O₅, anamorphous SiC layer, or other such materials.

[0044] Other structures that might be used for the non-ohmic deviceinclude at least two oppositely oriented diodes. The oppositely orienteddiodes can be connected either in series or in parallel.

[0045] When two diodes are in series, one diode's forward current isblocked by the other diode at low voltages. However, at the breakdownvoltage of each diode, the resistance to current flow diminishesgreatly. Hence, in this embodiment, it is the diodes' breakdown voltagesthat define V_(NO+) and V_(NO−).

[0046] When the diodes are in parallel, multiple diodes could be used ina diode ring formation in order to have an appropriate forward biasvoltage drop. For example, if each diode where to have a forward biasvoltage drop of 0.7V, placing two diodes in series oriented in the samedirection would produce a total forward bias voltage drop of 1.4V.Similarly, a chain of two diodes in parallel with and oppositelyoriented to the previous two diodes would cause the entire non-ohmicdevice to exhibit a high resistance from −1.4V to +1.4V.

[0047] Yet another structure that might be used was described in a papercalled “A switching Device based on a-Si:H N-i-dp-i-n stacked structure:Modeling and characterization,” by Domenico Caputo and Giampiero deCesare (IEEE Transactions on Electron Devices, Vol 43, No 12, December1996), incorporated herein by reference for all purposes. The five layerstructure described in the paper consists of an n-type silicon layer, anintrinsic silicon layer, a very thin p-type silicon layer, an intrinsicsilicon layer and an n-type layer.

[0048] Those skilled in the art will appreciate that the above-describedvoltages are voltages seen by the memory plug 315, and not necessarilythe absolute values of the voltages from ground. For example, placing 10volts on the selected x-direction conductive array line 305 and 6 voltson the selected y-direction conductive array line 310 would still attaina 4-volt drop. If the voltage drop across any single unselected memoryplug was to be no more than 3 volts, then unselected conductive arraylines 320, 325, 330, 335 and 340 would need to be held somewhere between7 volts and 9 volts in the above example.

[0049] Preferably, the unselected conductive array lines 320, 325, 330,335 and 340 would be held at a constant voltage, regardless of whether aread or write operation was being performed. Therefore, if the selectedx-direction conductive array line 310 were placed at 12 volts, then they-direction unselected conductive array lines 320 and 325 would need tobe held at 9 volts in the above example in order to keep the maximumvoltage drop to 3 volts. If symmetry was desired, a write operationmight require the x-direction conductive array line 310 be held to 11volts, the y-direction conductive array line 305 be held to 5 volts andall the unselected conductive array lines 320, 325, 330, 335 and 340 beheld to 8 volts (halfway between the voltages of the two conductivearray lines 305 and 310 for both read and write operations).

[0050] As illustrated in the preferred embodiment of FIGS. 5A and 5B,each conductive array line 305, 310, 320, 325, 330, 335 and 340 isassociated with a pass device 505, 510, 515, 520, 525, 530 and 535 (onen-type and one p-type transistor). The gate voltages of each transistorare adjusted such that the selected conductive array lines 305 and 310are allowed to pass a voltage from the drivers 540. The voltage that ispassed can either be the full voltage from the drivers 540 during awrite operation (a magnitude of 3 volts in the above example) in a firstselect mode, a partial voltage during a read operation (a magnitude of 2volts in the above example) in a second select mode, or no voltage forthe unselected lines in an unselect mode. Therefore, the pass devices505 can act as part of the decoding circuitry as a type of modulatingcircuit, allowing one conductive array line to be on (“selected”) ateither a read or write voltage and the other conductive array lines tobe off (“unselected”). FIG. 5A illustrates the logical connections andFIG. 5B illustrates the same connections, but with a different physicallayout (the pass devices alternating on each end of the conductive arraylines).

[0051] Alternatively, in place of the pass devices pass device 505, 510,515, 520, 525, 530 and 535, a single transistor can be used. However,the transistor's gate voltage would need to be such that it could passlarge magnitude voltages. For example, an n-channel transistor wouldpass the full 3V if its gate were held to 3V plus the n-channeltransistor's threshold voltage. A single transistor could still act as amodulating circuit by only partially turning on the transistor.

[0052] In another embodiment, the modulation is performed upstream ofthe gate circuit. Regardless of whether the gate circuit is a passdevice or a single transistor, the input to the gate circuit wouldalready be at an appropriate read or write voltage. In this embodiment,the gate circuit would only have a first select mode (passingsubstantially the full input voltage) and an unselect mode (passingsubstantially no voltage).

[0053] It should be noted that if the unselected conductive array lines320, 325, 330, 335 and 340 were not held to a certain voltage, theywould be considered floating, which is generally discouraged in circuitdesign. Specifically, a problem would arise if, for example, anunselected y-direction conductive array line 340 were floating at −3volts. If the selected x-direction conductive array line 305 was at 3volts and the selected y-direction conductive array line 310 was at −3volts, two cells 315 and 545 would see a 6-volt drop, potentiallydisturbing the resistive states of both cells.

[0054]FIG. 6A illustrates one mechanism for preventing the unselectedconductive array lines 320, 325, 330, 335 and 340 from floating to anundesired voltage. Prior to a read or write operation, each pass device505, 510, 515, 520, 525, 530 and 535 would have both of theirtransistors turned on, the drivers 540 would be deactivated, and voltagereference generators 605 would be at some reference voltage (presumed tobe ground for the remainder of this document). Therefore, all theconductive array lines 305, 310, 320, 325, 330, 335 and 340 would bepulled to the reference voltage. During the read or write operation, thevoltage reference generator 605 would be deactivated, the driver 540would be activated, and only the appropriate pass devices 505 and 510would be on, bringing the selected conductive array lines 305 and 310 tothe driver voltage. Although the unselected conductive array lines 320,325, 330, 335 and 340 would be floating during a read or writeoperation, their parasitic capacitance might keep them at the referencevoltage for the time it takes to do a normal read or write cycle.However, lateral coupling capacitance will work against the parasiticcapacitance, raising the voltage on the unselected conductive arraylines 320, 325, 330 and 335 adjacent to the selected conductive arraylines 305 and 310.

[0055]FIG. 6B illustrates another mechanism for preventing theunselected conductive array lines 320, 325, 330, 335 and 340 fromfloating to an undesired voltage. Each conductive array line 305, 310320, 325, 330, 335 and 340 would have an associated grounding passdevice 610, 615, 620, 625, 630, 635 and 640 that allows the conductivearray lines 305, 310 320, 325, 330, 335 and 340 to be pulled to groundwhen activated.

[0056] The grounding pass devices 610, 615, 620, 625, 630, 635 and 640could be activated prior to a read or write operation (similar to theoperation described in connection with FIG. 6A), could be triggered bythe selection of a conductive array line, or could always be kept on. Ifthe grounding pass devices 610, 615, 620, 625, 630, 635 and 640 werealways on, their relative size would need to be small in relation to thedecoding pass devices 505, 510, 515, 520, 525, 530 and 535 so that theleakage to ground would have a small effect.

[0057] If the grounding pass devices 610, 615, 620, 625, 630, 635 and640 were triggered by the selection of a conductive array line, theprocess of selecting the x-direction conductive array line 305, wouldactivate the decoding pass device 505 and deactivate the grounding passdevice 610 associated with the selected conductive array line 305 whiledeactivating the decoding pass devices 515 and 520 and activating thegrounding pass devices 635 and 640 associated with the unselectedconductive array lines 320 and 325. Similarly, selecting the y-directionconductive array line 310 would activate the decoding pass device 510and deactivate the grounding pass device 615 associated with theselected conductive array line 310 while deactivating the decoding passdevices 525, 530 and 535 and activating the grounding pass devices 620,625 and 630 associated with the unselected conductive array lines 330,335 and 340.

[0058]FIG. 6C is an improvement on FIG. 6B. However, instead of passdevices 610, 615, 620, 625, 630, 635 and 640, a single transistor 645,650, 655, 660, 665, 670 and 675 is used. Assuming the transistors 645,650, 655, 660, 665, 670 and 675 were n-channel devices, they would be ononly if the gate voltage were held to at least the threshold voltages ofthe transistors. Similarly, if the transistors were p-channel devices,they would be on if the gate voltages were held to at least the negativethreshold voltages. Therefore, an appropriate gate voltage can fullydischarge the conductive array lines.

[0059] The single n-channel (or p-channel) transistor embodiment can beused either at the beginning of a cycle or by using the inverse of thesignal that activates the n-channel (or p-channel) portion of thedecoding pass devices 505, 510, 515, 520, 525, 530 and 535. As shown inFIG. 6D, in some embodiments, the inverse signal might simply be thep-channel (or n-channel) portion of the decoding pass devices 505, 510,515, 520, 525, 530 and 535.

[0060]FIG. 6E illustrates yet another mechanism for preventing theunselected conductive array lines 320, 325, 330, 335 and 340 fromfloating to an undesired voltage by using a 3-output driver 680. Sincethe 3-output driver 680 would deliver a voltage to all of the decodingpass devices 505, 510, 515, 520, 525, 530 and 535, such a mechanismcould not be used while a specific conductive array line was beingselected. Therefore, the 3-output driver 680 could either be used todischarge the floating voltages prior to a read or write operation.Alternatively, the 3-output driver 680 could be used during a read orwrite operation if it were only used in connection with unselectedbanks, assuming multiple 3-output drivers 680 are used for multiplebanks.

[0061]FIG. 7 illustrates one possible configuration of a 3-output driver680. A p-channel transistor 705 and an n-channel transistor 710 arearranged in series. The n-channel transistor may be in a separate wellfrom the CMOS logic because the substrate is tied to a negative voltage.The source of the p-channel transistor 705 is connected to a voltagesource of +½ V_(W)′ and the source of the n-channel transistor 710 isconnected to a voltage source of −½ V_(W)′. The drains of bothtransistors are connected to both the decoding pass devices 505, 510,515, 520, 525, 530 and 535 and transistor to ground 815. In order todischarge the entire line, the transistor to ground 715 would need tohave an appropriate gate voltage, as described in connection with FIG.6C, or be a pass device. The 3-output driver 680 would function whenonly one transistor 705, 710 or 715 was on, while the other twotransistors were off.

[0062] Depending on the embodiment, the driver 540 or the 3-outputdriver 680, must be able to supply either +½ V_(W)′ or −½ V_(W)′ to thedecoding pass devices 505, 510, 515, 520, 525, 530 and 535. This isbecause applying a pulse of V_(W)′ in one direction (+V_(W)′) willdecrease the resistive state of the CMO material 225 from R₀ to R₁ andapplying a pulse of V_(W)′ in the opposite direction (−V_(W)′) willincrease the resistive state from R₁ to R₀.

[0063] The polarity of the voltage drop is not important during a read.The resistive state of the memory element can be detected regardless ofwhether the x-direction conductive array line 305 is V_(R)′ higher orV_(R)′ lower than the y-direction conductive array line 310. However, itis probably desirable to alternate polarities of reads so the memoryelements will not be subjected to any long-term read disturbs.

[0064] Additionally, a write operation would usually be preceded by aread operation in order to ensure a write is necessary. In other words,+V_(W)′ should only be applied to a memory plug in its R₀ resistivestate and −V_(W)′ should only be applied to a memory plug in its R₁resistive state. By ensuring that a voltage pulse is only used when theCMO material 225 needs to change state, the CMO material 225 would noteither be placed in a resistive state lower than R₁ or higher than R₀ orsuffer any degradation that occurs with certain CMO materials.Additionally, avoiding a write operation will reduce disturbing theunselected cells and improve the endurance of the selected cell,avoiding unnecessarily stressing the cross point memory array 100.

[0065] If a read operation is used prior to a write operation, thepolarity of the read should be the same as the polarity of the writeoperation that would follow, if required. For example, if the data to bewritten is “0” then the selected x-direction conductive array line 305would be 3V and the selected y-direction conductive array line 310 wouldbe −3V. If the read operation preceding the write used +2V on theselected x-direction conductive array line 305 and −2V on the selectedy-direction conductive array line 310, then the circuitry would onlyneed to switch 1V for both conductive array lines 305 and 310. This canbe preferable to the alternative (−2V on the selected x-directionconductive array line 305 and +2V on the selected y-direction conductivearray line 310), which would require the voltage to switch a total of5V.

[0066] The ability of the CMO material 225 to be placed into severaldifferent resistive states can be exploited to store more than one bitof information per memory plug 205. By adjusting the pulse width andvoltage height of the voltage pulses that change the resistive states ofthe CMO material 225, multiple resistive states can be used. Forexample, the CMO material 225 might have a high resistive state of R₀₀,a medium-high resistive state of R₀₁, a medium-low resistive state ofR₁₀ and a low resistive state of R₁₁. A sensitive reading mechanismmight be able to distinguish between three or more bits of informationcontained in the CMO material 225.

[0067] A benefit of some CMO materials is that the characteristichysteresis allows non-destructive reads. As shown in FIG. 8A anyvoltages between −V_(R) (−1 volt) and +V_(R) (1 volt) will have noeffect on the resistive state of the memory element (i.e., it willremain at either 100 kΩ or 1 MΩ). Therefore, a write operation is notnecessary after a read operation for such materials.

[0068] As shown in FIG. 8A, the hysteresis has two write thresholdvoltages, one for when the CMO material 225 is in the low resistivestate and one for when the CMO material 225 is in the high resistivestate. In the low resistive state, the first write threshold voltage isthe point above which any voltages applied across the CMO material 225have substantially no effect on the resistive state of the CMO material225 and below which a voltage pulse will alter the resistance of the CMOmaterial 225. Similarly, in the high resistive state, the second writethreshold voltage is the point below which any voltages applied acrossthe CMO material 225 have substantially no effect on the resistive stateof the CMO material 225 and above which a voltage pulse will alter theresistance of the CMO material 225.

[0069] When initially fabricated, the CMO material 225 may be in a highresistive state. The CMO material 225 then transitions from its highresistive state to a low resistive state in response to a voltage pulse.Whether the x-direction conductive array line 305 is at +3V and they-direction conductive array line 310 is at −3V in order to lower theresistive sate or visa-versa depends upon the specific properties of thematerial that is used. FIG. 8A is an example of the CMO material 225that requires a +2V pulse to lower its resistive state and FIG. 8B, amirror image of FIG. 8A, is an example of the CMO material 225 thatrequires a −2V pulse to lower its resistive state.

[0070] It should be noted that the actual write voltage that is used onthe CMO material 225 is greater in magnitude than the write thresholdvoltage. The actual write voltage is a voltage pulse that would placethe CMO material 225 into the desired resistive state, which may belower than the highest physically attainable resistive state and higherthan the lowest attainable resistive state. However, in FIG. 8A theappropriate write voltage for the previously described exemplary CMOmaterial 225 is −2V when it is in its low resistive state and 2V when itis in its high resistive state.

[0071] Ideally, the CMO material 225 should switch very quickly from oneresistive state to another. For current applications, anything less than50 nanoseconds would be an appropriate switching speed. Additionally,once the CMO material 225 is placed in a resistive state, it should beable to retain that state for long periods of time. Ideally, thematerial should retain its resistive state for over ten years. Since theread voltage should not affect the resistive state, repeated applicationof the read voltage over ten years should not change the resistive stateof the CMO material 225.

[0072] Generally, the chemical and materials properties of the memoryelement are selected to meet the electrical specifications set forthabove. For example, the material preferably has a resistivity of notgreater than about 1 ohm-cm, exhibits a change in resistance of at leastabout 10x, and has this resistance change triggered by the applicationof a voltage pulse of not longer than about 100 ns duration and notgreater than about than 3V in magnitude. In addition, the memory elementmaterial should be compatible with the requirements imposed by thegeneral fabrication process of the entire high density RAM. Of course,there is some flexibility in the process constraints. Thus, process anddesign engineers will have certain ranges of chemical, materials, andprocess parameters available to tailor for the specific goals at hand.Among these parameters are the annealing conditions, the depositiontemperature and method, and the material stoichiometry and thethickness.

[0073] To allow rapid access times (on the order of tens of nanoseconds)in small dimension devices (on the order of hundreds of nanometers), thememory element material should have a resistivity of not more than about1 ohm-cm. It is known that the resistivity of the complex metal oxidesdepends upon various factors, often including some of the following:film thickness, oxygen content of the film, stoichiometry, elementalcomposition, deposition method and conditions, degree of crystallinity,crystallite size, crystalline orientation, and doping level and choiceof dopant. Current research indicates that suitably low resistivity(less than or equal to 1 ohm-cm) CMO materials can be achieved byjudicious choice of these parameters.

[0074] One example of a suitable film thickness for the memoryapplications of this invention is approximately 1000 Å to 3000 Å.Thinner films sometimes have higher strains, usually resulting from aslight misalignment with the seed layer, which can result in higherresistivity. Film thickness has been discussed by S. I. Khartsev, et al.in “Colossal magnetoresistance in ultrathin epitaxialLa_(0.75)Sr_(0.25)MnO₃ films,” Journal of Applied Physics, Vol. 87, No.5, 1 Mar. 2000, which is hereby incorporated by reference for allpurposes.

[0075] Another factor that affects resistivity is the oxygen content ofthe film. By properly controlling the exposure to oxygen duringdeposition and annealing (if any) the resistivity can be controlled. Ithas been observed that 1500 Å lanthanum manganese oxide (LMO) filmsdeposited by pulsed laser deposition in oxygen environments have a lowerresistivity than films deposited in vacuum (but otherwise identicalconditions). See Y. G. Zhao, et al., “Effect of oxygen content on thestructural, transport, and magnetic properties of La_(1−δ)Mn_(1−δ)O₃thin films,” Journal of Applied Physics, Vol. 86, No. 11, 1 Dec. 1999,which is hereby incorporated by reference for all purposes. Cooling downthe freshly deposited film in an oxygen-containing atmosphere furtherdecreases film resistivity.

[0076] It has been further observed that adjusting the relative amountsof the rare earths and the alkaline earth metals can modify resistivity.Higher ratios of alkaline earth to rare earth metals can, to a degree(e.g., up to about 50:50 in lanthanum calcium manganese oxides), lowerresistivity. See Guo-Qiang Gong, et al., “Colossal magnetoresistance of1000000-fold magnitude achieved in the antiferromagnetic phase ofLa_(1−x)Ca_(x)MnO₃,” Applied Physics Letters, Vol. 67, No. 12, 18 Sep.1995, which is hereby incorporated by reference for all purposes.

[0077] Further, it has been found that some polycrystalline materialsmay have lower resistivities than their amorphous and single crystalcounterparts. It has also been observed that magnitude of the resistancechanges in single crystal CMO films exceeds that of the polycrystallinefilms. Large changes (i.e., greater than about 10×), are, however, nottypically necessary for making a practical memory chip.

[0078] In light of the above, some specific CMO materials suitable foruse with this invention will have the following properties: (1) thethickness of the deposited complex metal oxide film is between 1000 Åand 3000 Å; (2) the deposition and cool down and post depositionannealing (if any) is performed in an oxygen rich ambient; (3) the ratioof the rare earth and alkaline earth metals is adjusted for lowestresistivity, e.g., about 0.5; (4) the material is deposited or annealedto give a polycrystalline structure; (5) the material is deposited orannealed to increase the percentage of crystallites in a preferredorientation; and (6) the CMO material is doped with a material that hasthe effect of pinning the oxygen vacancies. Regarding the last property,it has been found that a small percentage of chrome doping also has abeneficial effect on reliability and endurance of some CMO films.

[0079] In addition to the above properties, certain process and designfeatures are important. First, the seed layer or other “substrate” onwhich the CMO deposits impacts the resistivity of the CMO and otherproperties. Often the underlying crystrallographic orientation of thesubstrate will epitaxially propagate to the upper levels the CMOelement. So, for example, if the underlying substrate has a 100orientation, then the CMO may preferentially deposit in a 100orientation. Preferably, the underlying substrate is a conductiveelectrode such a noble metal (e.g., platinum) or relatively conductiveCMO such as LaNiO₃. In polycrystalline structures, suitable crystallitesizes may range from about 100 Å to about 500 Å.

[0080] The general process operations for creating a complex metal oxidememory element include (1) providing a substrate on which to directlyform the memory element, (2) depositing the memory element material onthe substrate, and optionally (3) post-processing the deposited materialto impart a desired property. As indicated above, the substrate materialshould be polycrystalline or single crystalline, be conductive, andserve as an electrode.

[0081] Various physical vapor deposition (PVD) and chemical vapordeposition (CVD) techniques may be employed. Many forms of PVD and CVDcan be employed, assuming that they operate at temperatures compatiblewith the overall device fabrication technology. Post-processingoperations must also meet the temperature strictures of the technology.Often, this means that the deposition process should operate attemperatures below 600° C.

[0082] Although thin-film processes such as facing target sputtering andlaser annealing after deposition might allow for the formation of acrystalline memory element at temperatures low enough to use copper oraluminum conductive array lines, most thin-film processes would requiretemperatures of about 600° C. to form crystalline memory elements.Therefore, any layers of conductive array lines underneath the memoryelements would need to withstand those temperatures.

[0083] As an example, conductive array lines of tungsten (W) willwithstand high temperature processes. FIG. 9 is an exemplary flow chartof various processing steps that could be involved in a W cross pointarray. FIG. 10 is an elevation view of a cell 1000 formed with theprocessing steps. At 905, standard front end of line (FEOL) processescan be used to form the active circuitry that drives the cross pointmemory array. FEOL processes are generally defined as operationsperformed on a semiconductor wafer in the course of device manufacturingup to first metallization, and might end with chemical-mechanicalpolishing (CMP) of an inter-layer dielectric (ILD) 1002, such as SiO₂.

[0084] Regardless of the FEOL process, the next processing step at 910is formation of contact holes through the ILD 1002 to appropriatepositions in the circuitry followed by W plug 1005 formation at 915. Abarrier/adhesion layer 1010 of 100 Å of Ti followed by 200 Å of TiNcould be sputtered on the wafer, followed by 5000 Å of W deposited usingCVD, followed by etchback or CMP to remove W on the ILD surface 1002,leaving W plugs 1005 in the contact holes.

[0085] Once the plugs are formed, the W conductive array lines 1020 arepatterned on the wafer at 920. Since W has a relatively highresistivity, the maximum length and minimum cross-sectional area may belimited in comparison to aluminum or copper. Specifically, the maximumlength and cross-sectional area of the conductive array lines 1020 canbe determined using $R = \frac{\rho \quad L}{A}$

[0086] and setting a maximum resistance to about 10 kΩ in order tomaintain fast access times. Assuming 5000 Å thick metallization layersand a feature size of 0.25 μm, the length of the conductive array lines1020 would be a maximum of about 2000 μm long. The W conductive arraylines 1020 can be achieved through a barrier/adhesion layer 1015 of 100Å of Ti plus 200 Å of TiN, followed by 5000 Å of W deposition throughCVD, followed by mask, etch, and resist strip steps.

[0087] Another ILD layer 1025 could be deposited over the first layer ofconductive array lines at 925. The dielectric layer 1025 can be a thicklayer of SiO₂, deposited over the W conductive array lines 1020 byplasma-enhanced chemical vapor deposition (PECVD) and then planarized byCMP to expose the top surfaces of the W lines 1020.

[0088] At step 930 the bottom electrodes 1030 are deposited. First, a500 Å thick barrier layer of TiN is deposited to prevent metalinter-diffusion, followed by a 200 Å seed layer of LaNiO₃ (LNO) orSrRuO₃ (SRO). These layers can be deposited by sputtering.

[0089] At step 935 approximately 2000 Å of memory material 1035 having astoichiometry of Pr_(0.7)Ca_(0.3)MnO₃ is deposited at about 600° C. by aphysical vapor deposition technique such as sputtering. As previouslyexplained, the memory element 1035 would have a low resistance of 100kOhm and a high resistance of 1 MOhm, and would change state with a lessthan 50 ns flat pulse at 2V. At 940 another electrode 1040 (200 Å of LNOor SRO and another 500 Å of TiN are deposited via sputtering) isdeposited on top of the memory element 1035.

[0090] At 945 through 955 the non-ohmic device 1045 is formed. Thedevice 1045 can be formed by first sputtering 250 Å of Al, followed by50 Å of Al₂O₃, and another 250 Å of sputtered Al. The Al₂O₃ could beformed by atomic layer deposition (ALD) or oxidization of Al. The Al₂O₃thickness would be chosen to achieve a V_(NO+) of 4V. After thenon-ohmic device 1045, another 500 Å barrier layer 1050 of sputtered TiNis optionally deposited in step 955 to prevent metal inter-diffusion.

[0091] At 960 standard photolithography and appropriate multi-step etchprocesses could be used to pattern the memory/non-ohmic film stack intomemory cell plug. At 965 the spaces between the plugs could then befilled in by depositing a 250 Å etch stop/diffusion barrier 1055 ofSi₃N₄, followed by a thick SiO₂ interlayer dielectric (ILD) 1060, whichis planarized by CMP.

[0092] At 970 via holes are formed. Via holes with W plugs could beformed to provide connections between metal interconnect layers.Standard photolithography and via etch could be used to make via holes.These via holes could be filled by depositing 100 Å of Ti, followed by200 Å of TiN, followed by a 5000 Å W layer. CMP could then be used toremove W on the ILD surface 1060, leaving the W plugs in the via holes.

[0093] If there are no more memory elements to form at high temperature,the final layer of conductive array lines may comprise aluminum, copperor other high conductivity metal. A top layer of conductive array linescould then be formed at 980 by depositing, in order, anotherbarrier/adhesion layer 1065 of 100 Å of Ti and 200 Å of TiN, then theconductive array line 1070 comprising 5000 Å of an Al/Cu mixture, andthen a final barrier/adhesion layer 1075 of 100 Å of Ti, 200 Å of TiN.An anti-reflective coating (ARC) 1080, such as SiON could also bedeposited. A final mask, etch and resist strip would then be performed.The final cross-point memory array could then be 16384 W conductivearray lines by 4096 Al/Cu conductive array lines to create a 64 Mbitarray. 16 of these arrays could be laid side-by-side to create a 1 Gbitmemory.

[0094] Note that the above example assumes that memory elements areformed by a high temperature process that could be incompatible withconventional aluminum and copper deposition processes. Other processesfor forming memory elements at low temperatures exist. These includefacing target sputtering and laser annealing.

[0095] Although the invention has been described in its presentlycontemplated best mode, it is clear that it is susceptible to numerousmodifications, modes of operation and embodiments, all within theability and skill of those familiar with the art and without exercise offurther inventive activity. Accordingly, that which is intended to beprotected by Letters Patent is set forth in the claims and includes allvariations and modifications that fall within the spirit and scope ofthe claim.

What is claimed is:
 1. An apparatus comprising: a first layer ofconductive array lines, the conductive array lines being arranged sothat they do not come into direct contact with each other; a secondlayer of conductive array lines, the conductive array lines beingarranged so that they do not come into direct contact with either eachother or any of the conductive array lines of the first layer; aplurality of memory plugs located at the intersections of the firstlayer of conductive array lines and the second layer of conductive arraylines, each memory plug being in electrical contact with one of theconductive array lines from the first layer and one of the conductivearray lines from the second layer such that each memory plug isassociated with a unique pair of conductive array lines; and circuitryin electrical contact with the conductive array lines that provides areference voltage to the conductive array lines when activated; whereina single memory plug can be selected by selecting a unique pair ofconductive array lines that is associated with the single memory plug,the unique pair consisting of a first layer conductive array line and asecond layer conductive array line; applying a first select voltage tothe first layer conductive array line; and applying a second selectvoltage to the second layer conductive array line.
 2. The apparatus ofclaim 1, wherein the reference voltage is applied to unselectedconductive array lines.
 3. The apparatus of claim 2, wherein thereference voltage providing circuitry includes a plurality oftransistors, each transistor being capable of bringing a singleconductive array line to the reference voltage when turned on.
 4. Theapparatus of claim 3, wherein the reference voltage providing circuitryincludes a plurality of pass devices, each pass device being capable ofbringing a single conductive array line to the reference voltage whenturned on.
 5. The apparatus of claim 3, wherein the reference voltage isnot applied while the unique pair of conductive array lines is beingselected.
 6. The apparatus of claim 5, wherein the reference voltage isapplied to all of the conductive array lines.
 7. The apparatus of claim3, wherein the reference voltage is applied while the unique pair ofconductive array lines is being selected.
 8. The apparatus of claim 7,wherein a first layer select signal is used to select the first layerconductive array line; and the first layer select signal is also used toprevent the transistor associated with first layer conductive array linefrom turning on.
 9. The apparatus of claim 8, wherein the inverse of thefirst layer select signal is used as a gate voltage to the transistorassociated with first layer conductive array line.
 10. The apparatus ofclaim 1, wherein the reference voltage is not applied while the uniquepair of conductive array lines is being selected; and activation of thereference voltage providing circuitry brings all conductive array linesto the reference voltage.
 11. The apparatus of claim 1, furthercomprising: a plurality of first layer selection circuitry, each firstlayer selection circuitry: being in electrical contact with a group ofconductive array lines on the first layer; being capable of providing afirst select voltage to any first layer conductive array line within thegroup; and a plurality of second layer selection circuitry, each secondlayer selection circuitry: being in electrical contact with a group ofconductive array lines on the second layer; being capable of providing asecond select voltage to any second layer conductive array line withinthe group; and wherein the first layer selection circuitry hasintegrated the reference voltage providing circuitry such that the firstlayer selection circuitry can provide either a select voltage to a firstlayer conductive array line within its associated group of conductivearray lines or provide a reference voltage to its associated group ofconductive array lines; and the second layer selection circuitry hasintegrated the reference voltage providing circuitry such that thesecond layer selection circuitry can provide either a select voltage toa second layer conductive array line within its associated group ofconductive array lines or provide a reference voltage to its associatedgroup of conductive array lines.
 12. The apparatus of claim 11, whereinthe reference voltage is, while the unique pair of conductive arraylines are being selected, applied to the groups of conductive arraylines that are not associated with the unique pair of conductive arraylines.
 13. The apparatus of claim 11, wherein the reference voltage isnot applied to the conductive array lines during the selection of theunique pair of conductive array lines.
 14. The apparatus of claim 1,wherein the reference voltage is ground.
 15. A method of selecting asingle memory plug on a cross point memory array and preventingunselected conductive array lines from floating to an undesired voltagecomprising: selecting a unique pair of conductive array lines associatedwith the single memory plug, the unique pair consisting of a first layerconductive array line and a second layer conductive array line; applyinga first select voltage to the first layer conductive array line; andapplying a second select voltage to the second layer conductive arrayline; and providing a reference voltage to the unselected conductivearray lines.
 16. A method of claim 15, wherein the reference voltage isnot applied while the unique pair of conductive array lines is beingselected.